Invention Grant
- Patent Title: Tantalum embedded microchip
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Application No.: US14664957Application Date: 2015-03-23
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Publication No.: US09966196B2Publication Date: 2018-05-08
- Inventor: Joseph W. Paulus , John R. Sturmer
- Applicant: AVX Corporation
- Applicant Address: US SC Fountain Inn
- Assignee: AVX Corporation
- Current Assignee: AVX Corporation
- Current Assignee Address: US SC Fountain Inn
- Agency: Dority & Manning, P.A.
- Main IPC: H01G9/00
- IPC: H01G9/00 ; H01G9/02 ; H01G9/04 ; H01G9/145 ; H01G9/042 ; H01G9/045 ; H01G4/228 ; H01G9/10 ; H05K5/03 ; H01G9/012 ; H01G9/15 ; H01G9/07

Abstract:
A solid electrolytic capacitor and method for making the capacitor are provided. The capacitor includes a sintered porous anode body; a sintered anode substrate; a dielectric that overlies at least a portion of the anode body and at least a portion of the anode substrate and that is also formed within at least a portion of the anode body; a solid electrolyte cathode overlying at least a portion of the dielectric that overlies the anode body; an anode termination that is electrically connected to the anode substrate; and a cathode termination that is electrically connected to the solid electrolyte. The anode body is disposed on a planar surface of the anode substrate, and both the anode body and substrate are formed from a powder of a valve metal composition. Further, the anode substrate is hermetic and impermeable to liquids.
Public/Granted literature
- US20160284476A1 Tantalum Embedded Microchip Public/Granted day:2016-09-29
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