Invention Grant
- Patent Title: Surface modification process for laser application
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Application No.: US15232738Application Date: 2016-08-09
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Publication No.: US09966260B1Publication Date: 2018-05-08
- Inventor: Clayton Ka Tsun Chan , Ion Bita , Ranjith Samuel E. John , Alfred F. Renaldo , Jie Fu , Sudirukkuge T. Jinasundera , An-Chun Tien
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Rutan & Tucker, LLP
- Main IPC: B32B38/10
- IPC: B32B38/10 ; H01L21/033 ; H01L29/861 ; H01L29/66 ; H01L21/683 ; H01L21/268 ; B29C71/04 ; B29D11/00
Abstract:
Laser lift-off methods are described in which optical flatness is provided on the back side of a temporary substrate using either an optical layer or optical liquid. A laser is directed through the optical layer or optical liquid and a back side of the temporary substrate to decompose a portion of a process layer supported on a front side of the temporary substrate, followed by separation of the process layer and the temporary substrate.
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