Invention Grant
- Patent Title: Apparatus for semiconductor wafer treatment and semiconductor wafer treatment
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Application No.: US15137010Application Date: 2016-04-25
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Publication No.: US09966266B2Publication Date: 2018-05-08
- Inventor: Yu-Ying Lin , Chueh-Yang Liu , Yu-Ren Wang , Chun-Wei Yu , Kuang-Hsiu Chen , Yi-Liang Ye , Hsu Ting , Neng-Hui Yang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/268 ; H01L21/67 ; H01L21/265 ; H01L21/3065 ; H01L21/306 ; H01L21/687 ; H01L29/66
Abstract:
An apparatus for semiconductor wafer treatment includes a wafer holding unit configured to receive a single wafer, at least a solution supply unit configured to apply a solution onto the wafer and an irradiation unit configured to emit irradiation to the wafer. The irradiation unit further includes at least a plurality of first light sources configured to emit irradiation in FIR range and a plurality of second light sources configured to emit irradiation in UV range.
Public/Granted literature
- US20170309485A1 APPARATUS FOR SEMICONDUCTOR WAFER TREATMENT AND SEMICONDUCTOR WAFER TREATMENT Public/Granted day:2017-10-26
Information query
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