Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US15263478Application Date: 2016-09-13
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Publication No.: US09966286B2Publication Date: 2018-05-08
- Inventor: Takashi Nogami , Tomoshi Taniyama , Kazuma Yoshioka
- Applicant: HITACHI KOKUSAI ELECTRIC INC.
- Applicant Address: JP Tokyo
- Assignee: HITACHI KOKUSAI ELECTRIC INC.
- Current Assignee: HITACHI KOKUSAI ELECTRIC INC.
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: JP2014-058823 20140320
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677

Abstract:
A space needed to transfer a substrate container is decreased. A substrate processing apparatus includes a locating part where a substrate container accommodating a substrate is located; a driving unit configured to drive the locating part vertically; a transfer robot configured to transfer the substrate container; and a controller configured to control the driving unit and the transfer robot to move the locating part downward after the transfer robot moves to under the locating part to transfer the substrate container from the locating part to the transfer robot.
Public/Granted literature
- US20160379858A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2016-12-29
Information query
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