A method of producing wettable fillets in electronic packages. A matrix of unsingulated lead frames is provided, each including a plurality of lead elements and a chip pad. Chips are attached to the chip pads and terminals on the chips are electrically connected to lead portions of the lead elements. The top portion of the package is encapsulated. Masking is applied to the bottom surface of the lead elements and the chip pads, but at least one of the lead elements has a portion of its surfaced remaining exposed. The exposed lead element surface is etched to create a fillet. The fillets, lead elements and bottom surface of the chip pads are plated, and the packages then singulated, producing packages with wettable flanks.