Invention Grant
- Patent Title: Integrated circuit structure
-
Application No.: US15262574Application Date: 2016-09-12
-
Publication No.: US09966378B2Publication Date: 2018-05-08
- Inventor: David Yen , Sung-Chieh Lin , Kuoyuan (Peter) Hsu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8238 ; H01L21/263 ; H01L29/66 ; H01L27/06

Abstract:
A method for forming an integrated circuit includes forming a deep n-well (DNW) in a substrate, and forming a PMOS transistor in the DNW. The method also includes forming an NMOS transistor in the substrate and outside the DNW, and forming a reverse-biased diode. The method further includes forming an electrical path between a drain of the PMOS transistor and a gate structure of the NMOS transistor. The dissipation device is also connected to the electrical path.
Public/Granted literature
- US20160379983A1 INTEGRATED CIRCUIT STRUCTURE Public/Granted day:2016-12-29
Information query
IPC分类: