A method of manufacturing an image capturing apparatus is provided. The method comprises forming a structure which includes an interlayer insulation film having a plurality of opening portions above an imaging and a peripheral region, forming a first film so as to cover the structure arranged above the imaging and the peripheral region while filling the plurality of opening portions, planarizing the first film to form a waveguide member above the imaging and the peripheral region, forming a second film so as to cover the waveguide member above the imaging and the peripheral region after the planarizing the first film, polishing the second film to expose the waveguide member arranged above the imaging region and removing a portion of the waveguide member arranged above the peripheral region so as to expose the interlayer insulation film after the polishing the second film.