Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US15250147Application Date: 2016-08-29
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Publication No.: US09966445B2Publication Date: 2018-05-08
- Inventor: Masahito Kanamura
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2013-254111 20131209
- Main IPC: H01L21/285
- IPC: H01L21/285 ; H01L21/66 ; H01L29/417 ; H01L29/47 ; H01L29/778 ; H01L29/66 ; H01L29/423 ; H01L29/20 ; H01L23/31 ; H01L23/495 ; H01L29/205 ; H02M1/42 ; H02M3/335 ; H03F1/32 ; H03F3/19 ; H03F3/21

Abstract:
A semiconductor device includes first, a second, and third semiconductor layers respectively made of a nitride semiconductor and stacked on a substrate, a drain electrode formed on the third semiconductor layer, a gate electrode formed on the third semiconductor layer, and a source electrode formed within an opening penetrating the third and second semiconductor layers and exposing the first semiconductor layer. The source electrode includes a first conductor layer in contact with the first semiconductor layer, and a second conductor layer stacked on the first conductor layer and in contact with the second semiconductor layer. A work function of a material forming the first conductor layer is smaller than that of a material forming the second conductor layer.
Public/Granted literature
- US20160365419A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2016-12-15
Information query
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