Invention Grant
- Patent Title: Stacked Gate-All-Around FinFET and method forming the same
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Application No.: US14675160Application Date: 2015-03-31
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Publication No.: US09966471B2Publication Date: 2018-05-08
- Inventor: Kuo-Cheng Ching , Chi-Wen Liu , Ying-Keung Leung
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L27/12 ; H01L21/02 ; H01L29/165 ; H01L21/8244 ; H01L21/336 ; H01L21/8234 ; H01L29/10 ; H01L27/092 ; H01L21/265

Abstract:
A device includes a first semiconductor strip, a first gate dielectric encircling the first semiconductor strip, a second semiconductor strip overlapping the first semiconductor strip, and a second gate dielectric encircling the second semiconductor strip. The first gate dielectric contacts the first gate dielectric. A gate electrode has a portion over the second semiconductor strip, and additional portions on opposite sides of the first and the second semiconductor strips and the first and the second gate dielectrics.
Public/Granted literature
- US20160240681A1 Stacked Gate-All-Around FinFET and Method Forming the Same Public/Granted day:2016-08-18
Information query
IPC分类: