Invention Grant
- Patent Title: Aluminum-tin paste and its use in manufacturing solderable electrical conductors
-
Application No.: US14715113Application Date: 2015-05-18
-
Publication No.: US09966479B2Publication Date: 2018-05-08
- Inventor: Elena V Rogojina , Gonghou Wang , Elizabeth Tai , Maxim Kelman
- Applicant: E I DU PONT DE NEMOURS AND COMPANY
- Applicant Address: US DE Wilmington
- Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee Address: US DE Wilmington
- Main IPC: H01L31/042
- IPC: H01L31/042 ; H01L31/0224 ; H01B1/02 ; B23K35/02 ; B23K35/26 ; B23K35/28 ; C22C13/00 ; C22C21/00
Abstract:
The present invention is directed to a paste composition comprising Al and Sn dispersed in an organic medium and to paste compositions that provide a solderable electrode. The present invention is further directed to an electrode formed from the paste composition and a semiconductor device and, in particular, a solar cell comprising such an electrode. The paste compositions that provide a solderable electrode are particularly useful for forming a solar cell back side solderable electrode.
Public/Granted literature
- US20150364615A1 ALUMINUM-TIN PASTE AND ITS USE IN MANUFACTURING SOLDERABLE ELECTRICAL CONDUCTORS Public/Granted day:2015-12-17
Information query
IPC分类:
