A film-forming composition according to the present invention includes: a fluororesin having a repeating unit of the formula (1) and a repeating unit of the general formula (2); and a fluorine-containing solvent. In the general formula (2), R1 represents a C1-C15 straight, C3-C15 branched or C3-C15 cyclic hydrocarbon group in which at least one hydrogen atom may be replaced by a fluorine atom or chlorine atom and which may have a hydroxy group. This film-forming composition is suitably usable for the manufacturing of an organic semiconductor element as the composition can form a fluororesin film on an organic semiconductor film; and the formed film has resistance to an etching solvent during the fine pattern processing of the organic semiconductor film by photolithography etc.