A surface-emitting laser apparatus includes a surface-emitting laser substrate; a microlens substrate; and an adhesion agent. The surface-emitting laser substrate includes a semiconductor substrate; and a surface-emitting laser and plural first adhesion fixing regions formed on a first face of the semiconductor substrate. The microlens substrate includes a microlens configured to receive light emitted by the surface-emitting laser; plural pier portions protruding toward a side of the first face of the semiconductor substrate; and plural second adhesion fixing regions, formed at positions corresponding to the first adhesion fixing regions on surfaces of the pier portions. The adhesive agent causes the first adhesion fixing regions and the second adhesion fixing regions to adhere to each other. A restoring force acts on the adhesive agent in a case where the adhesive agent is melted. The surface-emitting laser substrate and the microlens substrate are self-aligned with each other according to the restoring force.