Invention Grant
- Patent Title: Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
-
Application No.: US14777670Application Date: 2014-04-17
-
Publication No.: US09967974B2Publication Date: 2018-05-08
- Inventor: Chee-Sung Park , Cheol-Hee Park , Shin Hee Jun , Sang Yun Jung , Han Nah Jeong
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2013-0046806 20130426; KR10-2014-0045363 20140416
- International Application: PCT/KR2014/003360 WO 20140417
- International Announcement: WO2014/175599 WO 20141030
- Main IPC: C23C18/16
- IPC: C23C18/16 ; C23C18/20 ; C23C18/40 ; C08J7/12 ; H05K1/03 ; H05K3/02 ; H05K3/18 ; H01B1/22

Abstract:
The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simple process, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern, including a polymer resin; and a non-conductive metal compound containing a first metal and a second metal, in which the non-conductive metal compound has a three-dimensional structure containing a plurality of first layers that contains at least one metal of the first and second metals and has edge-shared octahedrons two-dimensionally connected to each other and a second layer that contains a metal different from that of the first layer and is arranged between the neighboring first layers; and a metal core containing the first or second metal or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.
Public/Granted literature
Information query
IPC分类: