Invention Grant
- Patent Title: Electronic device enclosure and electronic device
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Application No.: US14822643Application Date: 2015-08-10
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Publication No.: US09967987B2Publication Date: 2018-05-08
- Inventor: Junsheng Guo , Lue Sun
- Applicant: Huawei Device Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Device Co., Ltd.
- Current Assignee: Huawei Device Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Slater Matsil, LLP
- Priority: CN201310177846 20130514
- Main IPC: H05K5/02
- IPC: H05K5/02

Abstract:
The present invention discloses an electronic device enclosure and an electronic device. The electronic device enclosure includes: a housing enclosing an exterior of an electronic component; and a baffle plate which is away from the housing by a preset distance and is disposed on an inner side of the housing, where at least one opening is disposed on each of the housing and the baffle plate, where positions of the opening of the baffle plate and the opening of the housing are mutually staggered in a perpendicular direction, and the opening of the housing faces a non-opening area of the baffle plate in the perpendicular direction.
Public/Granted literature
- US20150351265A1 Electronic Device Enclosure and Electronic Device Public/Granted day:2015-12-03
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