Invention Grant
- Patent Title: Printed circuit board enclosure assembly
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Application No.: US15344773Application Date: 2016-11-07
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Publication No.: US09967993B1Publication Date: 2018-05-08
- Inventor: Kevin Walker , Tod M. Harlan , Gottlieb Oyster , Nathan Potteiger
- Applicant: PHOENIX CONTACT DEVELOPMENT AND MANUFACTURING, INC.
- Applicant Address: US PA Middletown
- Assignee: Phoenix Contact Development and Manufacturing, Inc.
- Current Assignee: Phoenix Contact Development and Manufacturing, Inc.
- Current Assignee Address: US PA Middletown
- Agency: Hooker & Habib, P.C.
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/14 ; H05K5/03 ; H05K5/02
Abstract:
An enclosure assembly for housing printed circuit boards and related electrical components that provides secured component mounting in outdoor environments.
Public/Granted literature
- US20180132374A1 Printed Circuit Board Enclosure Assembly Public/Granted day:2018-05-10
Information query
