Invention Grant
- Patent Title: Multiple component bone void filling implant
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Application No.: US13457869Application Date: 2012-04-27
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Publication No.: US09968455B2Publication Date: 2018-05-15
- Inventor: James J. Rudnick , Christopher Michael Bennett , Anthony Wolverton , Jason Wainwright
- Applicant: James J. Rudnick , Christopher Michael Bennett , Anthony Wolverton , Jason Wainwright
- Applicant Address: US NJ Mahwah
- Assignee: Howmedica Osteonics Corp.
- Current Assignee: Howmedica Osteonics Corp.
- Current Assignee Address: US NJ Mahwah
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: A61F2/28
- IPC: A61F2/28 ; A61F2/30

Abstract:
Disclosed herein are implants and methods for filling voids in a cranium of a patient. A craniofacial implant that may be used for filling such voids may include at least first and second components each having outer and inner surfaces, the outer and inner surfaces being curved in an inferior to posterior direction and a medial to lateral direction. The first component includes a flange extending outwardly from a medial side surface thereof and the second component includes a recessed portion extending inwardly from a medial side surface thereof. The first and second components are preferably engageable to one another such that the medial side surfaces of the first and second components are adjacent one another and the flange of the first component is housed within the recessed portion of the second component.
Public/Granted literature
- US20130289727A1 MULTIPLE COMPONENT BONE VOID FILLING IMPLANT Public/Granted day:2013-10-31
Information query
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