Invention Grant
- Patent Title: Wire saw apparatus and cut-machining method
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Application No.: US14435721Application Date: 2012-10-15
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Publication No.: US09969017B2Publication Date: 2018-05-15
- Inventor: Shoji Imakurusu , Toshimitsu Iwai , Jun Ohya , Masaru Fukuman
- Applicant: TOYO ADVANCED TECHNOLOGIES CO., LTD.
- Applicant Address: JP Hiroshima
- Assignee: Toyo Advanced Technologies Co., Ltd.
- Current Assignee: Toyo Advanced Technologies Co., Ltd.
- Current Assignee Address: JP Hiroshima
- Agency: Knobbe, Martens, Olson & Bear, LLP
- International Application: PCT/JP2012/006589 WO 20121015
- International Announcement: WO2014/061053 WO 20140424
- Main IPC: B23D61/18
- IPC: B23D61/18 ; B23D57/00 ; B28D5/04 ; B24B27/06

Abstract:
A wire saw apparatus 1 executes cut-machining by pressing a workpiece W against a cutting wire 3 spirally wound around multiple wire guides 2, while running the cutting wire 3 and simultaneously swinging the wire guides 2 as well as the cutting wire 3. The wire saw apparatus 1 includes a controller 8 controlling a position of a workpiece holder 51 for holding the workpiece W. The position is controlled depending on a swing angle of the cutting wire 3 so that machined portion of the workpiece W is shaped into an arc.
Public/Granted literature
- US20150290728A1 WIRE SAW APPARATUS AND CUT-MACHINING METHOD Public/Granted day:2015-10-15
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