Invention Grant
- Patent Title: Polishing layer of polishing pad and method of forming the same and polishing method
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Application No.: US15176157Application Date: 2016-06-08
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Publication No.: US09969049B2Publication Date: 2018-05-15
- Inventor: Kun-Che Pai , Yu-Hao Pan
- Applicant: IV Technologies CO., Ltd.
- Applicant Address: TW Taichung
- Assignee: IV Technologies CO., Ltd.
- Current Assignee: IV Technologies CO., Ltd.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: TW104120966A 20150629
- Main IPC: B24B37/26
- IPC: B24B37/26 ; B24B37/24
Abstract:
A polishing layer of a polishing pad is provided. The polishing layer of the polishing pad includes a carrier layer and a plurality of embedded sections. The embedded sections embedded in the carrier layer are located in a polishing surface of the polishing layer, wherein in the polishing surface of the polishing layer, a groove is included in the carrier layer between every two adjacent embedded sections.
Public/Granted literature
- US20160375546A1 POLISHING LAYER OF POLISHING PAD AND METHOD OF FORMING THE SAME AND POLISHING METHOD Public/Granted day:2016-12-29
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