- Patent Title: MEMS device, liquid ejecting head, and liquid ejecting apparatus
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Application No.: US15493011Application Date: 2017-04-20
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Publication No.: US09969162B2Publication Date: 2018-05-15
- Inventor: Munehide Saimen , Eiju Hirai , Masao Nakayama
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2016-088878 20160427
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
A MEMS device includes a first substrate in which a first electrode layer, a dielectric layer, and a second electrode layer are stacked on a driving region in this order; and a second substrate which is disposed to face a surface on which the dielectric layer of the first substrate is stacked. The first electrode layer and the dielectric layer extend beyond the second electrode layer toward a non-driving region separated from the driving region, a first resin having elasticity is disposed in a region including an end of the second electrode layer in an extending direction of the dielectric layer, and the first substrate and the second substrate are fixed with an adhesive in a state where the elastically deformed first resin is sandwiched therebetween.
Public/Granted literature
- US20170313074A1 MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS Public/Granted day:2017-11-02
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