- Patent Title: Manufacturing method and manufacturing device for wrapped molding
-
Application No.: US14759248Application Date: 2013-12-16
-
Publication No.: US09969510B2Publication Date: 2018-05-15
- Inventor: Shota Takamatsu
- Applicant: Enplas Corporation
- Applicant Address: JP Saitama
- Assignee: ENPLAS CORPORATION
- Current Assignee: ENPLAS CORPORATION
- Current Assignee Address: JP Saitama
- Agency: Brundidge & Stanger, P.C.
- Priority: JP2013-001958 20130109
- International Application: PCT/JP2013/007393 WO 20131216
- International Announcement: WO2014/108962 WO 20140717
- Main IPC: B65B11/40
- IPC: B65B11/40 ; B65B47/04 ; B29C45/00 ; B65B47/02 ; B65B7/16 ; B29C43/02 ; B65B35/10 ; B65B51/10 ; B29C45/76 ; B29C45/42 ; B65B5/04 ; B29L9/00 ; B29L31/00 ; B29C45/17

Abstract:
This manufacturing method for wrapped moldings (P) comprises a molding process for manufacturing the moldings (P) and a wrapping process for wrapping the moldings (P). The molding cycle from a mold-clamping step to the next mold-clamping step in the molding process is coordinated with the wrapping cycle from a moving step to the next moving step in the wrapping process by delaying the heating initiation time in the heating step, reducing the rate of temperature increase in the heating step, or prolonging the time for the drawing in the drawing step.
Public/Granted literature
- US20160001901A1 MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR WRAPPED MOLDING Public/Granted day:2016-01-07
Information query
IPC分类: