Silica sol and silica-containing epoxy resin composition
Abstract:
The silica sol of the invention contains silica particles having a mean primary particle size of 20 to 100 nm and which has a silica particle size/mean primary particle size ratio, determined through dynamic light scattering, of 3.0 or less, wherein the silica particles are surface-treated with an organic silane compound and have an α-ray emission rate of 0.005 counts/cm2·hr or less and a moisture absorption coefficient, determined after allowing the silica particles to stand for 48 hours at 23° C. and a relative humidity of 50 RH %, of 0.5 mass % or lower.
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