Invention Grant
- Patent Title: Polyamide composition with low thermal conductivity
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Application No.: US13516582Application Date: 2010-12-16
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Publication No.: US09969883B2Publication Date: 2018-05-15
- Inventor: Gerard Bradley
- Applicant: Gerard Bradley
- Applicant Address: FR Aubervilliers
- Assignee: Rhodia Operations
- Current Assignee: Rhodia Operations
- Current Assignee Address: FR Aubervilliers
- Agency: Osha Liang LLP
- Priority: FR0959041 20091216
- International Application: PCT/EP2010/069867 WO 20101216
- International Announcement: WO2011/073305 WO 20110623
- Main IPC: C08L77/02
- IPC: C08L77/02 ; C08L77/06 ; C08K7/20 ; C08K7/28 ; C08L55/02
Abstract:
A polyamide composition that can be used in different transformation methods and, in particular, for the production of an extrusion profile having a low thermal conductivity, is described. One such composition includes, in particular, glass beads. Also described is a composition, preferably a molding composition, e.g., in the form of granules or powder, that can be used to produce items by means of injection molding.
Public/Granted literature
- US20120316261A1 POLYAMIDE COMPOSITION WITH LOW THERMAL CONDUCTIVITY Public/Granted day:2012-12-13
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