The present invention is directed to methods of improving burnish resistance of substrates comprising: (1) applying to at least a portion of the substrate a curable film-forming composition comprising: (a) a polymeric binder comprising at least one polymeric resin having reactive functional groups; (b) a curing agent containing functional groups that are reactive with the reactive functional groups of (a); and (c) silica particles that have been functionalized on their surfaces with an amino silane so as to impart the surfaces with primary amino functional groups; and (2) (a) heating the coated substrate to a temperature and for a time sufficient to cure the curable film-forming composition or (b) allowing a time sufficient to cure the curable film-forming composition under ambient conditions. The present invention is further directed to solventborne, curable film-forming compositions comprising the components (a) (b) and (c) above.