Invention Grant
- Patent Title: Electrically conducting path
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Application No.: US15346238Application Date: 2016-11-08
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Publication No.: US09972417B2Publication Date: 2018-05-15
- Inventor: Hironobu Yamamoto , Toshinari Kobayashi , Masaharu Nakamura
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Yokkaichi, Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie
- Agency: Dinsmore & Shohl LLP
- Priority: JP2015-230726 20151126
- Main IPC: H02G3/04
- IPC: H02G3/04 ; H01B7/285 ; H01B7/282 ; B60R16/02

Abstract:
An electrically conducting path including: an electrical wire; an exterior member made of rubber and enclosing a portion of the electrical wire; a waterproof member filling a gap between an opening part of an end portion of the exterior member and the electrical wire; and a molded resin member that is in intimate contact with and covers, in a liquid-tight state, an outer circumferential surface of the end portion of the exterior member, the waterproof member, and a section of the electrical wire that is exposed to an outside of the exterior member. Since the gap between the opening part of the end portion of the exterior member and the electrical wire is sealed in a liquid-tight state by the waterproof member and the molded resin member, it is possible to prevent water from entering the inside of the exterior member.
Public/Granted literature
- US20170154706A1 ELECTRICALLY CONDUCTING PATH Public/Granted day:2017-06-01
Information query
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