In a substrate processing apparatus, a temperature of an anti-static liquid having electrical resistivity which gradually decreases as a liquid temperature increases is adjusted by a temperature adjustment part and the electrical resistivity of the anti-static liquid is higher than the electrical resistivity of a processing liquid (SPM liquid). After that, a plurality of substrates are immersed in the anti-static liquid inside the anti-static liquid storage part and both main surfaces of each substrate entirely conic into contact with the anti-static liquid. This gradually removes static electricity from the substrate. Then, the SPM liquid is supplied onto an upper surface of the substrate to thereby perform an SPM process. In the SPM process, it is thereby possible to prevent a large amount of electric charges from sharply moving from the substrate to the SPM liquid and prevent any damage to the substrate.