Invention Grant
- Patent Title: Process of forming semiconductor optical device and semiconductor optical device
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Application No.: US15405998Application Date: 2017-01-13
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Publication No.: US09972973B2Publication Date: 2018-05-15
- Inventor: Takayuki Watanabe
- Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Applicant Address: JP Yokohama
- Assignee: Sumitomo Electric Device Innovations, Inc.
- Current Assignee: Sumitomo Electric Device Innovations, Inc.
- Current Assignee Address: JP Yokohama
- Agency: Venable LLP
- Agent Michael A. Sartori; Miguel A. Lopez
- Priority: JP2016-005432 20160114
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01S5/227 ; H01S5/30 ; H01S5/343 ; H01L21/02 ; H01S5/32 ; H01S5/042 ; H01S5/22

Abstract:
A semiconductor laser diode type of a buried-hetero structure (BH-LD) is disclosed. The LD provides a mesa, a first burying layer, and a second burying layer, where the burying layers are provided in respective sides of the mesa so as to expose a top of the mesa. The mesa includes a lower cladding layer, an active layer, and an upper cladding layer, where the cladding layers have conduction type opposite to each other and, combined with the burying layers, constitute a carrier confinement structure. The second burying layer has an even surface overlapping with an even surface of the first burying layer, and has a thickness in a portion of the even surface that is thinner than a thickness thereof in a portion except for the even surface.
Public/Granted literature
- US20170207604A1 PROCESS OF FORMING SEMICONDUCTOR OPTICAL DEVICE AND SEMICONDUCTOR OPTICAL DEVICE Public/Granted day:2017-07-20
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