Invention Grant
- Patent Title: Miniature high density opto-electronic package
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Application No.: US13729518Application Date: 2012-12-28
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Publication No.: US09974163B2Publication Date: 2018-05-15
- Inventor: Morgan Chen , Rongsheng Miao , Xueyan Zheng , Bo Li , Xiao Shen , Yu Sheng Bai
- Applicant: Futurewei Technologies, Inc.
- Applicant Address: US TX Plano
- Assignee: FUTUREWEI TECHNOLOGIES, INC.
- Current Assignee: FUTUREWEI TECHNOLOGIES, INC.
- Current Assignee Address: US TX Plano
- Agency: Futurewei Technologies, Inc.
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/02 ; H05K3/36 ; H05K3/32 ; G02B6/42

Abstract:
A method comprising coupling a circuit to an opto-electronic package via an anisotropic conductive film (ACF), wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 gigahertz (GHz) to about 40 GHz. An apparatus comprising, an opto-electronic package comprising a plurality of first electrodes, and a circuit comprising a plurality of second electrodes, wherein at least one of the first electrodes is coupled to at least one of the second electrodes via an ACF, and wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 GHz to about 40 GHz.
Public/Granted literature
- US20140185253A1 Miniature High Density Opto-Electronic Package Public/Granted day:2014-07-03
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