Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.