Invention Grant
- Patent Title: Circuit board and method for fabricating the same
-
Application No.: US14943747Application Date: 2015-11-17
-
Publication No.: US09974171B2Publication Date: 2018-05-15
- Inventor: Qiang Xu , Xinping Lin
- Applicant: BYD COMPANY LIMITED
- Applicant Address: CN Shenzhen
- Assignee: BYD COMPANY LIMITED
- Current Assignee: BYD COMPANY LIMITED
- Current Assignee Address: CN Shenzhen
- Priority: CN201310196540 20130523
- Main IPC: H05K1/05
- IPC: H05K1/05 ; H05K3/18 ; C25D11/24 ; H05K3/44 ; C23C18/18 ; C23C18/16 ; C25D11/08 ; C25D11/16 ; C23C18/40 ; C25D11/10

Abstract:
Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.
Public/Granted literature
- US20160073497A1 CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME Public/Granted day:2016-03-10
Information query