- Patent Title: Epoxy resin compound and radiant heat circuit board using the same
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Application No.: US14241961Application Date: 2012-08-30
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Publication No.: US09974172B2Publication Date: 2018-05-15
- Inventor: Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Jong Heum Yoon , In Hee Cho
- Applicant: Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Jong Heum Yoon , In Hee Cho
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2011-0088199 20110831
- International Application: PCT/KR2012/006919 WO 20120830
- International Announcement: WO2013/032238 WO 20130307
- Main IPC: H05K1/05
- IPC: H05K1/05 ; B32B27/38 ; C08L63/00 ; C09J163/00 ; C08K3/22 ; C08G59/22 ; C08G59/24 ; C08G59/38 ; C08L63/04 ; C09K5/14
Abstract:
An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
Public/Granted literature
- US20140318835A1 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME Public/Granted day:2014-10-30
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