Invention Grant
- Patent Title: Circuit assembly
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Application No.: US15326870Application Date: 2015-07-01
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Publication No.: US09974182B2Publication Date: 2018-05-15
- Inventor: Arinobu Nakamura
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd , Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-shi, Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-shi, Osaka
- Agency: Dinsmore & Shohl LLP
- Priority: JP2014-148721 20140722
- International Application: PCT/JP2015/069019 WO 20150701
- International Announcement: WO2016/013362 WO 20160128
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K1/18 ; H05K1/11

Abstract:
Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.
Public/Granted literature
- US20170202088A1 CIRCUIT ASSEMBLY Public/Granted day:2017-07-13
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