- Patent Title: Multilayer ceramic electronic component and board having the same
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Application No.: US15401568Application Date: 2017-01-09
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Publication No.: US09974183B2Publication Date: 2018-05-15
- Inventor: Eun Hyuk Chae , Hyun Hee Gu , Jong Ho Lee , Jae Yeol Choi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2016-0077313 20160621
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/18 ; H01G4/012 ; H01G4/12 ; H01G4/248 ; H01G4/30 ; H05K1/11 ; H05K3/34

Abstract:
A multilayer ceramic electronic component includes: a ceramic body including: an active part with dielectric layers interposed with a plurality of first and second internal electrodes; an upper cover part above the active part; a lower cover part below the active part and having a thickness greater than that of the upper cover part; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively, wherein the first and second external electrodes are disposed on respective end surfaces of the ceramic body in a length direction and on a lower surface of the ceramic body in a thickness direction and are not disposed on an upper surface of the ceramic body in the thickness direction.
Public/Granted literature
- US20170367187A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME Public/Granted day:2017-12-21
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