Invention Grant
- Patent Title: Printed board, electronic device, and method for manufacturing electronic device
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Application No.: US15355559Application Date: 2016-11-18
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Publication No.: US09974184B2Publication Date: 2018-05-15
- Inventor: Mitsuaki Hayashi , Osamu Saito , Akira Okada , Junichi Hayama
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2016-037149 20160229
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/34 ; H05K3/00
Abstract:
A printed board includes: a depression formed in at least one surface of a board; an open hole formed in the board so as to penetrate the board from a bottom portion of the depression; and a conductor formed over an edge of an opening portion of the open hole and an inner surface of the open hole.
Public/Granted literature
- US20170251554A1 PRINTED BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE Public/Granted day:2017-08-31
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