A component supply device loaded with a component supply tape for exposing and supplying an electronic component from the component supply tape with respect to a component mounting device mounting the electronic component on a substrate includes a replenishing unit performing replenishment of a new component supply tape when a preceding component supply tape is exhausted and a sensor senses exhaustion of the preceding component supply tape while a confluent portion where a channel for the preceding component supply tape and a channel for the new component supply tape join with each other is formed between the sensor and the replenishing unit. A buckling prevention mechanism moves in response to an operation of the preceding component supply tape or the new component supply tape for preventing buckling when the new component supply tape is transported to the component supply device by the replenishing unit is arranged on the confluent portion.