A semiconductor device includes a board, an electronic component, an evaluation component, a wiring, and a groove portion. The board includes a product area, a non-product area, and a boundary area between the product area and the non-product area. The electronic component is mounted in the product area. The evaluation component is mounted in the non-product area. The wiring electrically connects the electronic component and the evaluation component. The groove portion is formed in the boundary area of the board so as to overlap at least a part of the wiring in a plan view. The non-product area is surrounded by the groove portion and at least a portion of sides of the board.