Invention Grant
- Patent Title: High speed signal routing topology for better signal quality
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Application No.: US14595175Application Date: 2015-01-12
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Publication No.: US09980366B2Publication Date: 2018-05-22
- Inventor: Yokesh Subramanian
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Arent Fox, LLP and Qualcomm
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; H05K7/00 ; H05K1/02 ; G11C5/02

Abstract:
An apparatus including an output driver on a PCB and a number of chips on the PCB, the chips including a first chip and a second chip. The PCB includes a first transmission line connected to the output driver, a second transmission line connected to the first transmission line and the first chip, the second transmission line having a length greater than or equal to 10 times a length of the first transmission line, and a third transmission line connected to the first transmission line and the second chip, the third transmission line having a length greater than or equal to 10 times the length of the first transmission line. The second transmission line connects to the first chip without being coupled to a termination resistor on the PCB and the third transmission line connects to the second chip without being coupled to a termination resistor on the PCB.
Public/Granted literature
- US20160205767A1 NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY Public/Granted day:2016-07-14
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