Invention Grant
- Patent Title: Printed circuit board having a circular signal pad surrounded by a ground pad and at least one recess section disposed therebetween
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Application No.: US14912677Application Date: 2014-09-11
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Publication No.: US09980370B2Publication Date: 2018-05-22
- Inventor: Kazuhiro Kashiwakura
- Applicant: NEC Corporation
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2013-197419 20130924
- International Application: PCT/JP2014/004679 WO 20140911
- International Announcement: WO2015/045309 WO 20150402
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K3/00 ; H05K3/40 ; H01P1/04 ; H01P5/08
Abstract:
To provide a printed board that solves the problem of transmission characteristics deterioration, the disclosed printed board includes a substrate, a circular signal pad that is provided on the substrate, a doughnut-shaped ground pad, which sandwiches the substrate that surrounds, in a doughnut shape, the signal pad, and which surrounds the outer circumference of the substrate, and one or more recessed sections that are disposed on the substrate that surrounds, in the doughnut shape, the signal pad.
Public/Granted literature
- US20160205768A1 PRINTED BOARD AND METHOD FOR MOUNTING ON PRINTED BOARD Public/Granted day:2016-07-14
Information query
