Invention Grant
- Patent Title: Bonding electronic components to patterned nanowire transparent conductors
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Application No.: US14897521Application Date: 2014-07-18
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Publication No.: US09980394B2Publication Date: 2018-05-22
- Inventor: Matthew S. Stay , Mikhail L. Pekurovsky , Shawn C. Dodds , Ann M. Gilman , Daniel J. Theis
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agent James A. Baker
- International Application: PCT/US2014/047212 WO 20140718
- International Announcement: WO2015/017143 WO 20150205
- Main IPC: G02F1/1345
- IPC: G02F1/1345 ; H05K3/28 ; G06F3/041 ; G06F3/047 ; H05K1/02 ; H05K1/09 ; H05K3/10 ; H05K3/04 ; H05K3/32 ; H05K1/03
Abstract:
A method for making an electronic assembly includes applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate and engaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer.
Public/Granted literature
- US20160143153A1 BONDING ELECTRONIC COMPONENTS TO PATTERNED NANOWIRE TRANSPARENT CONDUCTORS Public/Granted day:2016-05-19
Information query
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