A label assembly comprised of a carrier strip and a plurality of labels. The carrier strip comprises at least a first backing layer and a layer of adhesive material located over said first backing layer. A second backing layer may be located over said adhesive layer. Predetermined areas are removed from the second backing area to expose the adhesive layer. Cover tabs overlay portions of the exposed adhesive layer with the labels being removably adhered to the carrier strip on the remaining exposed adhesive layer. The labels may be provided with frangible regions for partitioning the wire label. The frangible regions include both severed portions and points of attachment.