Invention Grant
- Patent Title: Capacitor, capacitor mounting structure, and taped electronic component series
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Application No.: US15678237Application Date: 2017-08-16
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Publication No.: US09984829B2Publication Date: 2018-05-29
- Inventor: Tadateru Yamada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2013-229162 20131105; JP2014-057592 20140320
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H01G4/30 ; H01G4/248 ; H05K1/18 ; H01G4/12 ; H01G4/012

Abstract:
In a capacitor main body, a dimension along the thickness direction of a first region where a first inner electrode and a second inner electrode are provided is t1, a dimension along the thickness direction of a second region that is positioned on the side of a first main surface relative to the first region is t2, and a dimension along the thickness direction of a third region that is positioned on the side of a second main surface relative to the first region is t3. A condition of t2/t1>about 0.15 and a condition of t3/t1>about 0.15 are satisfied.
Public/Granted literature
- US20170345575A1 CAPACITOR, CAPACITOR MOUNTING STRUCTURE, AND TAPED ELECTRONIC COMPONENT SERIES Public/Granted day:2017-11-30
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