Invention Grant
- Patent Title: Semiconductor devices and methods of manufacturing the same
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Application No.: US15001568Application Date: 2016-01-20
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Publication No.: US09984886B2Publication Date: 2018-05-29
- Inventor: Yoon-Hae Kim , Hwa-Sung Rhee , Keun-Hwi Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2015-0061423 20150430
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/285 ; H01L21/768

Abstract:
A semiconductor device includes a gate structure extending in a second direction on a substrate, a source/drain layer disposed on a portion of the substrate adjacent the gate structure in a first direction crossing the second direction, a first conductive contact plug on the gate structure, and a second contact plug structure disposed on the source/drain layer. The second contact plug structure includes a second conductive contact plug and an insulation pattern, and the second conductive contact plug and the insulation pattern are disposed in the second direction and contact each other. The first conductive contact plug and the insulation pattern are adjacent to each other in the first direction. The first and second conductive contact plugs are spaced apart from each other.
Public/Granted literature
- US20160322304A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2016-11-03
Information query
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