Invention Grant
- Patent Title: Method and device for leveling a substrate stack
-
Application No.: US15300488Application Date: 2015-03-31
-
Publication No.: US09984942B2Publication Date: 2018-05-29
- Inventor: Jurgen Burggraf , Friedrich Paul Lindner
- Applicant: EV Group E. Thallner GmbH
- Applicant Address: AT St. Florian am Inn
- Assignee: EV Group E. Thallner GmbH
- Current Assignee: EV Group E. Thallner GmbH
- Current Assignee Address: AT St. Florian am Inn
- Agency: Kusner & Jaffe
- Priority: DE102014106100 20140430
- International Application: PCT/EP2015/057054 WO 20150331
- International Announcement: WO2015/165679 WO 20151105
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/66 ; H01L21/67 ; H01L21/683
Abstract:
A method for equalizing the thickness variation of a substrate stack which is comprised of a product substrate and a carrier substrate and which is connected in particular by means of an interconnect layer, by local application of local thickness peaks by means of an application apparatus which has at least one application unit. Furthermore this invention relates to a corresponding device.
Public/Granted literature
- US20170110377A1 METHOD AND DEVICE FOR LEVELING A SUBSTRATE STACK Public/Granted day:2017-04-20
Information query
IPC分类:
