Invention Grant
- Patent Title: Semiconductor package and related methods
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Application No.: US15198799Application Date: 2016-06-30
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Publication No.: US09984968B2Publication Date: 2018-05-29
- Inventor: Yusheng Lin , Yenting Wen , George Chang
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: IPTechLaw
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/70 ; H01L21/304 ; H01L23/36 ; H01L23/528 ; H01L23/532 ; H01L23/522 ; H01L21/78
Abstract:
Implementations of semiconductor packages may include: a prefabricated electrically conductive section; two or more metal oxide semiconductor field effect transistors (MOSFET) physically coupled together; and a back metal coupled to the two or more MOSFETs; wherein the electrically conductive section may be coupled to the back metal and may be configured to electrically couple the two or more MOSFETs together during operation of the two or more MOSFETs.
Public/Granted literature
- US20180005936A1 SEMICONDUCTOR PACKAGE AND RELATED METHODS Public/Granted day:2018-01-04
Information query
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