Invention Grant
- Patent Title: Minimizing shorting between FinFET epitaxial regions
-
Application No.: US15494586Application Date: 2017-04-24
-
Publication No.: US09985024B2Publication Date: 2018-05-29
- Inventor: Kangguo Cheng , Balasubramanian Pranatharthiharan , Alexander Reznicek , Charan V. Surisetty
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent L. Jeffrey Kelly
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/78 ; H01L27/108 ; H01L27/12 ; H01L21/82 ; H01L29/423 ; H01L29/06 ; H01L29/49 ; H01L29/08 ; H01L21/8234 ; H01L29/66 ; H01L21/28 ; H01L21/8238 ; H01L27/092 ; H01L29/417

Abstract:
The present invention relates generally to semiconductors, and more particularly, to a structure and method of minimizing shorting between epitaxial regions in small pitch fin field effect transistors (FinFETs). In an embodiment, a dielectric region may be formed in a middle portion of a gate structure. The gate structure be formed using a gate replacement process, and may cover a middle portion of a first fin group, a middle portion of a second fin group and an intermediate region of the substrate between the first fin group and the second fin group. The dielectric region may be surrounded by the gate structure in the intermediate region. The gate structure and the dielectric region may physically separate epitaxial regions formed on the first fin group and the second fin group from one another.
Public/Granted literature
- US20170229455A1 MINIMIZING SHORTING BETWEEN FINFET EPITAXIAL REGIONS Public/Granted day:2017-08-10
Information query
IPC分类: