Invention Grant
- Patent Title: Fin field effect transistor structure and method to form defect free merged source and drain epitaxy for low external resistance
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Application No.: US15435974Application Date: 2017-02-17
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Publication No.: US09985114B2Publication Date: 2018-05-29
- Inventor: Veeraraghavan S. Basker , Oleg Gluschenkov , Shogo Mochizuki , Alexander Reznicek
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Daniel P. Morris
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/08 ; H01L29/04

Abstract:
A method of forming a semiconductor device that includes providing a plurality of fin structures, wherein a surface of the fin structures has a first orientation for a diamond shaped epitaxial growth deposition surface. A first epitaxial semiconductor material having a diamond geometry is grown on the diamond shaped epitaxial growth surface. A blocking material is formed protecting a lower portion of the first epitaxial semiconductor material. An upper portion of the first epitaxial semiconductor material is removed to expose a second orientation surface of the first epitaxial semiconductor material for merged epitaxial semiconductor growth. A second epitaxial semiconductor material is epitaxially formed on the first epitaxial semiconductor material. The second epitaxial semiconductor material has a substantially planar upper surface and extends into direct contact with at least two adjacent fin structures.
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