Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15260981Application Date: 2016-09-09
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Publication No.: US09985136B2Publication Date: 2018-05-29
- Inventor: Minoru Oda , Kiwamu Sakuma , Masumi Saitoh
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-178803 20150910
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/66

Abstract:
According to one embodiment, a semiconductor device includes first to third semiconductor regions and first to third conductors. The second semiconductor region is separated from the first semiconductor region in a first direction. The third semiconductor region is provided between the first and the second semiconductor regions. The third conductor is separated from the third semiconductor region in a second direction intersecting the first direction. The third semiconductor region includes first and second partial regions. The first partial region includes a first metal element, and is amorphous. The second partial region is stacked with the first partial region in the second direction, and is polycrystalline. A first concentration of the first metal element in the first partial region is higher than a second concentration of the first metal element in the second partial region, or the second partial region does not include the first metal element.
Public/Granted literature
- US20170077310A1 SEMICONDUCTOR DEVICE Public/Granted day:2017-03-16
Information query
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