Invention Grant
- Patent Title: Schottky diode and method of manufacturing the same
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Application No.: US15382562Application Date: 2016-12-16
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Publication No.: US09985143B2Publication Date: 2018-05-29
- Inventor: Hongwei Chen
- Applicant: Gpower Semiconductor, Inc.
- Applicant Address: CN Suzhou
- Assignee: Gpower Semiconductor, Inc.
- Current Assignee: Gpower Semiconductor, Inc.
- Current Assignee Address: CN Suzhou
- Agency: Flener IP & Business Law
- Agent Zareefa B. Flener
- Priority: CN201410663922 20141119
- Main IPC: H01L29/872
- IPC: H01L29/872 ; H01L29/40 ; H01L29/66 ; H01L29/417 ; H01L29/20 ; H01L29/205 ; H01L29/778

Abstract:
A Schottky diode comprises: a substrate; a first semiconductor layer located on the substrate; a second semiconductor layer located on the first semiconductor layer, two-dimensional electron gas being formed at an interface between the first semiconductor layer and the second semiconductor layer; a cathode located on the second semiconductor layer and forming an ohmic contact with the second semiconductor layer; a first passivation dielectric layer located on the second semiconductor layer; a field plate groove formed in the first passivation dielectric layer; and an anode covering the field plate groove and a portion of the first passivation dielectric layer.
Public/Granted literature
- US20170098719A1 SCHOTTKY DIODE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-04-06
Information query
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