Flip chip LEDs include a transparent substrate or carrier having an active material attached thereto and having a number of electrodes disposed along a common surface of the active material. The substrate may include a number of surface features disposed along a first surface adjacent the active material for improving light extraction from the active material, and includes a number of surface features along a second surface opposite the first surface for minimizing internal reflection of light through the substrate, thereby improving light extraction from the transparent substrate. The surface features on both surfaces may be arranged having a random or ordered orientation relative to one another. A plurality of such flip chip LEDs may be physically packaged together in a manner providing electrical connection with the same for a lighting end-use application.