Provided is an electrolytic copper foil significantly useful as electrodes for electronic devices. The electrolytic copper foil used for an electronic device according to the present invention includes copper or copper alloy, the electrolytic copper foil having a 0.2% proof stress of 250 N/mm2 or more after heat treatment at 200° C. for 60 min in a nitrogen atmosphere, wherein at least one of the surfaces of the electrolytic copper foil has a concave-dominant surface profile having a Pv/Pp ratio of 1.2 or more, the Pv/Pp ratio being a ratio of a maximum profile valley depth Pv to a maximum profile peak height Pp as determined in a rectangular area of 181 μm by 136 μm in accordance with JIS B 0601-2001.