- Patent Title: Pre-mold for a microphone assembly and method of producing the same
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Application No.: US13927865Application Date: 2013-06-26
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Publication No.: US09986354B2Publication Date: 2018-05-29
- Inventor: Thomas Mueller , Horst Theuss , Stefan Uwe Schindler , Dominik Kohl , Jochen Dangelmaier
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L21/78 ; H04R25/00 ; B81C1/00 ; H01L23/495 ; H04R31/00 ; H04R19/00 ; H04R19/04 ; H04R1/08
Abstract:
A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.
Public/Granted literature
- US20150001646A1 Pre-mold for a microphone assembly and method of producing the same Public/Granted day:2015-01-01
Information query
IPC分类:
